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EnglishExplain the differences between ALD, CVD, and sputtering, and introduce the types and characteristic
Deposition technology is critical in the manufacturing of the products we use, such as smartphones, personal computers, cars, semiconductors, etc.
Invisible coating technology supports our daily lives.
Since there are many types of deposition, this article summarizes the different types of deposition and their characteristics.
List of deposition types and characteristics
Various equipment and methods can be used for deposition, including vapor deposition, sputtering and chemical vapor deposition (CVD) and spin coating.
Even when the same material is deposited, its properties may vary depending on the method used.
Therefore, it is necessary to have some understanding of how different deposition methods affect film quality and performance.
See the list of deposition methods here.
Thin film production method |
detail |
|---|---|
Steaming method |
A technology that evaporates deposition materials such as metals and oxides in a vacuum container to form a thin film and deposit it on the opposite substrate surface. References ※1.2.3.4 |
Ion Plating (IP) |
The principle is almost the same as the vapor deposition method, but the vapor deposition method is to pass the vapor deposition particles through the plasma to ionize the vapor deposition material. A negative voltage is applied to the substrate on which the film is to be formed, and the ionized film-forming material is accelerated and hits the substrate to form a thin film. Through ionization and acceleration, a thin film with strong adhesion can be formed. Reference ※1.5 |
Sputtering |
The plasma ions (usually Ar+ ions) generated by the discharge hit the plate (target) where the material is to be deposited, causing the material to be sputtered. The sputtered deposited material flies toward the substrate, forming a thin film. Sputtering can be used for a variety of deposited materials, such as metals and alloys with high melting points, which are difficult to deposit using the evaporation method. References ※1.5.6 |
Chemical Vapor Deposition (CVD) |
A method of depositing a thin film by blowing a gas containing the element to be deposited onto the surface of the substrate through chemical reaction and decomposition. CVD There are different types, such as thermal CVD that heats the substrate and plasma CVD that depressurizes the reaction tube and generates plasma. References※1.7.8 |
Atomic Layer Deposition (ALD) Method |
Although ALD is called a type of CVD, it is actually a method of alternately introducing and exhausting two or more raw material gases (precursor, precursor) to form a film by causing the adsorbed raw material molecules to react on the surface of the deposited film. References※8 |